Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374611 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +4 more | 2025-07-29 |
| 12087679 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +4 more | 2024-09-10 |
| 12080632 | Glass core package substrates | Deepak Kulkarni, Rahul Agarwal, Rajasekaran Swaminathan | 2024-09-03 |
| 11931855 | Planarization methods for packaging substrates | Han-Wen Chen, Steven Verhaverbeke, Tapash Chakraborty, Prayudi Lianto, Prerna Goradia +3 more | 2024-03-19 |
| 11927885 | Fluoropolymer stamp fabrication method | Roman Gouk, Jean Delmas, Steven Verhaverbeke | 2024-03-12 |
| 11881447 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +4 more | 2024-01-23 |
| 11862546 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +2 more | 2024-01-02 |
| 11798903 | Methods of forming microvias with reduced diameter | Roman Gouk, Steven Verhaverbeke | 2023-10-24 |
| 11521937 | Package structures with built-in EMI shielding | Steven Verhaverbeke, Han-Wen Chen, Giback Park | 2022-12-06 |
| 11454884 | Fluoropolymer stamp fabrication method | Roman Gouk, Jean Delmas, Steven Verhaverbeke | 2022-09-27 |
| 11388822 | Methods for improved polymer-copper adhesion | Tapash Chakraborty, Steven Verhaverbeke, Han-Wen Chen, Prerna Goradia, Giback Park +1 more | 2022-07-12 |
| 11315890 | Methods of forming microvias with reduced diameter | Roman Gouk, Steven Verhaverbeke | 2022-04-26 |
| 11281094 | Method for via formation by micro-imprinting | Roman Gouk, Giback Park, Kyuil Cho, Han-Wen Chen, Steven Verhaverbeke +1 more | 2022-03-22 |
| 10937726 | Package structure with embedded core | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +2 more | 2021-03-02 |
| 10727083 | Method for via formation in flowable epoxy materials by micro-imprint | Roman Gouk, Kyuil Cho, Han-Wen Chen, Steven Verhaverbeke, Vincent DiCaprio | 2020-07-28 |