{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Applied Materials", "item": "https://www.patentleaderboard.com/company/applied-materials"}, {"@type": "ListItem", "position": 3, "name": "Chintan Buch", "item": "https://www.patentleaderboard.com/inventor/fl:ch_ln:buch-1"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
CB

Chintan Buch — 15 Patents

Applied Materials: 13 patents #1,046 of 7,310Top 15%
AMD: 1 patents #7,502 of 9,280Top 85%
Santa Clara, CA: #1,138 of 9,301 inventorsTop 15%
California: #40,789 of 386,348 inventorsTop 15%
Overall (All Time): #307,048 of 4,157,543Top 8%
15 Patents All Time
Chintan Buch has been granted 15 US patents while listed as an inventor at Applied Materials. The first was granted in 2020 and the most recent in July 2025. Chintan Buch ranks #307,048 of 4,157,543 US inventors in our database (top 7.4%). Patent records list Chintan Buch in Santa Clara, CA, US.

Patents per Year

Patents granted per year, 2020 to 2025Bar chart with a peak of 6 patents in 2024.peak 62020: 1 patents20202021: 1 patents20212022: 5 patents20222023: 1 patents20232024: 6 patents20242025: 1 patents2025

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12374611 Package core assembly and fabrication methods Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +4 more 2025-07-29
12087679 Package core assembly and fabrication methods Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +4 more 2024-09-10
12080632 Glass core package substrates Deepak Kulkarni, Rahul Agarwal, Rajasekaran Swaminathan 2024-09-03 $326,917,000
11931855 Planarization methods for packaging substrates Han-Wen Chen, Steven Verhaverbeke, Tapash Chakraborty, Prayudi Lianto, Prerna Goradia +3 more 2024-03-19 $54,086,000
11927885 Fluoropolymer stamp fabrication method Roman Gouk, Jean Delmas, Steven Verhaverbeke 2024-03-12 $97,620,000
11881447 Package core assembly and fabrication methods Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +4 more 2024-01-23 $48,508,000
11862546 Package core assembly and fabrication methods Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +2 more 2024-01-02 $40,045,000
11798903 Methods of forming microvias with reduced diameter Roman Gouk, Steven Verhaverbeke 2023-10-24 $34,065,000
11521937 Package structures with built-in EMI shielding Steven Verhaverbeke, Han-Wen Chen, Giback Park 2022-12-06 $44,170,000
11454884 Fluoropolymer stamp fabrication method Roman Gouk, Jean Delmas, Steven Verhaverbeke 2022-09-27 $38,581,000
11388822 Methods for improved polymer-copper adhesion Tapash Chakraborty, Steven Verhaverbeke, Han-Wen Chen, Prerna Goradia, Giback Park +1 more 2022-07-12 $30,931,000
11315890 Methods of forming microvias with reduced diameter Roman Gouk, Steven Verhaverbeke 2022-04-26 $43,127,000
11281094 Method for via formation by micro-imprinting Roman Gouk, Giback Park, Kyuil Cho, Han-Wen Chen, Steven Verhaverbeke +1 more 2022-03-22 $64,102,000
10937726 Package structure with embedded core Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +2 more 2021-03-02 $62,769,000
10727083 Method for via formation in flowable epoxy materials by micro-imprint Roman Gouk, Kyuil Cho, Han-Wen Chen, Steven Verhaverbeke, Vincent DiCaprio 2020-07-28 $35,855,000