Package structure with embedded core

Assignee

• Applied Materials

Inventors

• Han-Wen Chen (49 patents)
• Steven Verhaverbeke (136 patents)
• Giback Park (29 patents)
• Kyuil Cho (32 patents)
• Kurtis Leschkies (35 patents)
• Roman Gouk (49 patents)
• Chintan Buch (15 patents)
• Vincent DiCaprio (51 patents)

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