Issued Patents All Time
Showing 25 most recent of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374611 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +4 more | 2025-07-29 |
| 12354968 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giback Park, Giorgio Cellere +2 more | 2025-07-08 |
| 12087679 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +4 more | 2024-09-10 |
| 11935771 | Modular mainframe layout for supporting multiple semiconductor process modules or chambers | Randy Harris, Coby Scott GROVE, Paul Z. Wirth, Avinash SHANTARAM, Alpay Yilmaz +3 more | 2024-03-19 |
| 11935770 | Modular mainframe layout for supporting multiple semiconductor process modules or chambers | Randy Harris, Coby Scott GROVE, Paul Z. Wirth, Avinash SHANTARAM, Alpay Yilmaz +1 more | 2024-03-19 |
| 11887934 | Package structure and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini +1 more | 2024-01-30 |
| 11881447 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +4 more | 2024-01-23 |
| 11862546 | Package core assembly and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +2 more | 2024-01-02 |
| 11715700 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giback Park, Giorgio Cellere +2 more | 2023-08-01 |
| 11521935 | Package structure and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini +1 more | 2022-12-06 |
| 11476202 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giback Park, Giorgio Cellere +2 more | 2022-10-18 |
| 11398433 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giback Park, Giorgio Cellere +2 more | 2022-07-26 |
| 11342256 | Method of fine redistribution interconnect formation for advanced packaging applications | Han-Wen Chen, Steven Verhaverbeke, Kyuil Cho, Prayudi Lianto, Guan Huei See | 2022-05-24 |
| 11281094 | Method for via formation by micro-imprinting | Roman Gouk, Giback Park, Kyuil Cho, Han-Wen Chen, Chintan Buch +1 more | 2022-03-22 |
| 11264333 | Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration | Han-Wen Chen, Steven Verhaverbeke, Guan Huei See, Giback Park, Giorgio Cellere +2 more | 2022-03-01 |
| 11264331 | Package structure and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini +1 more | 2022-03-01 |
| 10937726 | Package structure with embedded core | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies +2 more | 2021-03-02 |
| 10886232 | Package structure and fabrication methods | Han-Wen Chen, Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini +1 more | 2021-01-05 |
| 10727083 | Method for via formation in flowable epoxy materials by micro-imprint | Roman Gouk, Chintan Buch, Kyuil Cho, Han-Wen Chen, Steven Verhaverbeke | 2020-07-28 |
| 8258613 | Semiconductor memory card | Kenneth Kaskoun | 2012-09-04 |
| RE40112 | Semiconductor package and method for fabricating the same | Won Sun Shin, Do Sung Chun, Sang Ho Lee, Seon Goo Lee | 2008-02-26 |
| 7211900 | Thin semiconductor package including stacked dies | Won Sun Shin, Do Sung Chun, Seon Goo Lee, Il Kwon Shim | 2007-05-01 |
| 7190071 | Semiconductor package and method for fabricating the same | Won Sun Shin, Seon Goo Lee, Do Sung Chun, Tae Hoan Jang | 2007-03-13 |
| 7126218 | Embedded heat spreader ball grid array | Robert Francis Darveaux, Frederick J. G. Hamilton, Bruce M. Guenin | 2006-10-24 |
| 7061120 | Stackable semiconductor package having semiconductor chip within central through hole of substrate | WonSun Shin, DoSung Chun, Sangho Lee, SeonGoo Lee | 2006-06-13 |