Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11266351 | Method, devices and systems for sensor with removable nodes | Brian David Niznik, Michael David Atella | 2022-03-08 |
| 10667751 | Methods, devices and systems for sensor with removable nodes | Brian David Niznik, Michael David Atella | 2020-06-02 |
| 10506977 | Method, devices and systems for sensor with removable nodes | Brian David Niznik, Michael David Atella | 2019-12-17 |
| 10271745 | Monolithic integrated emitter-detector array in a flexible substrate for biometric sensing | Shiqun Gu, Matthew Michael Nowak, Eugene Dantsker, Russel A. Martin | 2019-04-30 |
| 10182710 | Wearable dual-ear mobile otoscope | Muhammed Ibrahim Sezan, Eugene Dantsker, Brian David Niznik, Christopher Talbot, Ilene Klein | 2019-01-22 |
| 10025917 | Biometrics for user identification in mobile health systems | Muhammed Ibrahim Sezan, John K. Schneider, Eugene Dantsker | 2018-07-17 |
| 9974484 | Methods, devices and systems for sensor with removable nodes | Brian David Niznik, Michael David Atella | 2018-05-22 |
| 9955939 | Stethoscope system including a sensor array | Muhammed Ibrahim Sezan, Eugene Dantsker, Brian David Niznik, Christopher Talbot | 2018-05-01 |
| 9721409 | Biometrics for user identification in mobile health systems | Muhammed Ibrahim Sezan, John K. Schneider, Eugene Dantsker | 2017-08-01 |
| 9615794 | Method, devices and systems for sensor with removable nodes | Brian David Niznik, Michael David Atella | 2017-04-11 |
| 9572532 | Button sensor | Barry Matsumori, Matthew Michael Nowak, Nicholas Yu | 2017-02-21 |
| 9478528 | Devices, systems and methods using through silicon optical interconnects | Shiqun Gu, Matthew Michael Nowak | 2016-10-25 |
| 9385560 | Methods, devices and systems for self charging sensors | Kirk S. Taylor | 2016-07-05 |
| 9202705 | Integrated circuit module with lead frame micro-needles | Rongtian Zhang, Matthew Michael Nowak, Shiqun Gu | 2015-12-01 |
| 9138191 | Integrated circuit module with lead frame micro-needles | Rongtian Zhang, Matthew Michael Nowak, Shiqun Gu | 2015-09-22 |
| 8847360 | Systems and methods for enabling ESD protection on 3-D stacked devices | Shiqun Gu, Matthew Michael Nowak | 2014-09-30 |
| 8717057 | Integrated tester chip using die packaging technologies | Sanjay Jha | 2014-05-06 |
| 8502373 | 3-D integrated circuit lateral heat dissipation | Shiqun Gu, Matthew Michael Nowak | 2013-08-06 |
| 8258613 | Semiconductor memory card | Vincent DiCaprio | 2012-09-04 |
| 8080862 | Systems and methods for enabling ESD protection on 3-D stacked devices | Shiqun Gu, Matthew Michael Nowak | 2011-12-20 |
| 8076768 | IC interconnect | Shiqun Gu, Bart Swinnen | 2011-12-13 |
| 7985620 | Method of fabricating via first plus via last IC interconnect | Shiqun Gu, Bart Swinnen | 2011-07-26 |
| 7939926 | Via first plus via last technique for IC interconnects | Shiqun Gu, Bart Swinnen | 2011-05-10 |
| 7176062 | Lead-frame method and assembly for interconnecting circuits within a circuit module | Jeffrey Alan Miks, Markus K. Liebhard, Donald C. Foster, Paul R. Hoffman, Frederic Bertholio | 2007-02-13 |
| 7019387 | Lead-frame connector and circuit module assembly | Jeffrey Alan Miks, John Armando Miranda | 2006-03-28 |