| 7176062 |
Lead-frame method and assembly for interconnecting circuits within a circuit module |
Jeffrey Alan Miks, Kenneth Kaskoun, Donald C. Foster, Paul R. Hoffman, Frederic Bertholio |
2007-02-13 |
| 6900527 |
Lead-frame method and assembly for interconnecting circuits within a circuit module |
Jeffrey Alan Miks, Kenneth Kaskoun, Donald C. Foster, Paul R. Hoffman, Frederic Bertholio |
2005-05-31 |
| 6717822 |
Lead-frame method and circuit module assembly including edge stiffener |
Jeffrey Alan Miks |
2004-04-06 |
| 6629633 |
Chip size image sensor bumped package fabrication method |
Thomas P. Glenn, Steven Webster |
2003-10-07 |
| 6620646 |
Chip size image sensor wirebond package fabrication method |
Thomas P. Glenn, Steven Webster |
2003-09-16 |
| 6589801 |
Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniques |
Ju Hoon Yoon, Dae Byung Kang, In Bae Park, Vincent DiCaprio |
2003-07-08 |
| 6528857 |
Chip size image sensor bumped package |
Thomas P. Glenn, Steven Webster |
2003-03-04 |
| 6509637 |
Low profile mounting of thick integrated circuit packages within low-profile circuit modules |
— |
2003-01-21 |
| 6509560 |
Chip size image sensor in wirebond package with step-up ring for electrical contact |
Thomas P. Glenn, Steven Webster |
2003-01-21 |
| 6486537 |
Semiconductor package with warpage resistant substrate |
— |
2002-11-26 |
| 5764484 |
Ground ring for a metal electronic package |
Paul R. Hoffman |
1998-06-09 |