Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7176062 | Lead-frame method and assembly for interconnecting circuits within a circuit module | Jeffrey Alan Miks, Kenneth Kaskoun, Donald C. Foster, Paul R. Hoffman, Frederic Bertholio | 2007-02-13 |
| 6900527 | Lead-frame method and assembly for interconnecting circuits within a circuit module | Jeffrey Alan Miks, Kenneth Kaskoun, Donald C. Foster, Paul R. Hoffman, Frederic Bertholio | 2005-05-31 |
| 6717822 | Lead-frame method and circuit module assembly including edge stiffener | Jeffrey Alan Miks | 2004-04-06 |
| 6629633 | Chip size image sensor bumped package fabrication method | Thomas P. Glenn, Steven Webster | 2003-10-07 |
| 6620646 | Chip size image sensor wirebond package fabrication method | Thomas P. Glenn, Steven Webster | 2003-09-16 |
| 6589801 | Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniques | Ju Hoon Yoon, Dae Byung Kang, In Bae Park, Vincent DiCaprio | 2003-07-08 |
| 6528857 | Chip size image sensor bumped package | Thomas P. Glenn, Steven Webster | 2003-03-04 |
| 6509637 | Low profile mounting of thick integrated circuit packages within low-profile circuit modules | — | 2003-01-21 |
| 6509560 | Chip size image sensor in wirebond package with step-up ring for electrical contact | Thomas P. Glenn, Steven Webster | 2003-01-21 |
| 6486537 | Semiconductor package with warpage resistant substrate | — | 2002-11-26 |
| 5764484 | Ground ring for a metal electronic package | Paul R. Hoffman | 1998-06-09 |