Issued Patents All Time
Showing 25 most recent of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9224676 | Integrated circuit package and method of making the same | — | 2015-12-29 |
| 8963301 | Integrated circuit package and method of making the same | — | 2015-02-24 |
| 8853836 | Integrated circuit package and method of making the same | — | 2014-10-07 |
| 8318287 | Integrated circuit package and method of making the same | — | 2012-11-27 |
| 7786429 | Camera module with window mechanical attachment | Steven Webster | 2010-08-31 |
| 7609461 | Optical module having cavity substrate | Steven Webster, Roy Dale Hollaway | 2009-10-27 |
| 7560804 | Integrated circuit package and method of making the same | — | 2009-07-14 |
| 7425750 | Snap lid camera module | Steven Webster | 2008-09-16 |
| 7332375 | Method of making an integrated circuit package | — | 2008-02-19 |
| 7112474 | Method of making an integrated circuit package | — | 2006-09-26 |
| 7071541 | Plastic integrated circuit package and method and leadframe for making the package | — | 2006-07-04 |
| 7059040 | Optical module with lens integral holder fabrication method | Steven Webster, Roy Dale Hollaway | 2006-06-13 |
| 7030474 | Plastic integrated circuit package and method and leadframe for making the package | — | 2006-04-18 |
| 7005326 | Method of making an integrated circuit package | — | 2006-02-28 |
| 6967395 | Mounting for a package containing a chip | Steven Webster, Roy Dale Hollaway | 2005-11-22 |
| 6962829 | Method of making near chip size integrated circuit package | Roy Dale Hollaway, Anthony E. Panczak | 2005-11-08 |
| 6946316 | Method of fabricating and using an image sensor package | Steven Webster | 2005-09-20 |
| 6943429 | Wafer having alignment marks extending from a first to a second surface of the wafer | Roy Dale Hollaway, Steven Webster | 2005-09-13 |
| 6893900 | Method of making an integrated circuit package | — | 2005-05-17 |
| 6875379 | Tool and method for forming an integrated optical circuit | Steven Webster | 2005-04-05 |
| 6869861 | Back-side wafer singulation method | Roy Dale Hollaway, Steven Webster | 2005-03-22 |
| 6849916 | Flip chip on glass sensor package | Steven Webster, Roy Dale Hollaway | 2005-02-01 |
| 6816523 | VCSEL package and fabrication method | Roy Dale Hollaway, Steven Webster | 2004-11-09 |
| 6784534 | Thin integrated circuit package having an optically transparent window | Vincent Di Caprio, Steven Webster | 2004-08-31 |
| 6777789 | Mounting for a package containing a chip | Steven Webster, Roy Dale Hollaway | 2004-08-17 |