Issued Patents All Time
Showing 26–50 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6765801 | Optical track drain package | Roy Dale Hollaway | 2004-07-20 |
| 6734419 | Method for forming an image sensor package with vision die in lens housing | Steven Webster, Roy Dale Hollaway | 2004-05-11 |
| 6730536 | Pre-drilled image sensor package fabrication method | Steven Webster, Roy Dale Hollaway | 2004-05-04 |
| 6723582 | Method of making a semiconductor package having exposed metal strap | Blake A. Gillett | 2004-04-20 |
| 6717126 | Method of fabricating and using an image sensor package with reflector | Steven Webster, Roy Dale Hollaway | 2004-04-06 |
| 6686588 | Optical module with lens integral holder | Steven Webster, Roy Dale Hollaway | 2004-02-03 |
| 6684496 | Method of making an integrated circuit package | — | 2004-02-03 |
| 6686580 | Image sensor package with reflector | Steven Webster, Roy Dale Hollaway | 2004-02-03 |
| 6672773 | Optical fiber having tapered end and optical connector with reciprocal opening | Steven Webster | 2004-01-06 |
| 6670698 | Integrated circuit package mounting | Steven Webster, Roy Dale Hollaway | 2003-12-30 |
| 6667544 | Stackable package having clips for fastening package and tool for opening clips | — | 2003-12-23 |
| 6661080 | Structure for backside saw cavity protection | Steven Webster, Roy Dale Hollaway | 2003-12-09 |
| 6657298 | Integrated circuit chip package having an internal lead | — | 2003-12-02 |
| 6650019 | Method of making a semiconductor package including stacked semiconductor dies | Lee Smith, David Zoba, Kambhampati Ramakrishna, Vincent DiCaprio | 2003-11-18 |
| 6638789 | Micromachine stacked wirebonded package fabrication method | Steven Webster, Roy Dale Hollaway | 2003-10-28 |
| 6630728 | Plastic integrated circuit package and leadframe for making the package | — | 2003-10-07 |
| 6629633 | Chip size image sensor bumped package fabrication method | Steven Webster, Markus K. Liebhard | 2003-10-07 |
| 6627864 | Thin image sensor package | Steven Webster, Roy Dale Hollaway | 2003-09-30 |
| 6627987 | Ceramic semiconductor package and method for fabricating the package | Roy Dale Hollaway, Steven Webster | 2003-09-30 |
| 6624921 | Micromirror device package fabrication method | Steven Webster, Roy Dale Hollaway | 2003-09-23 |
| 6620646 | Chip size image sensor wirebond package fabrication method | Steven Webster, Markus K. Liebhard | 2003-09-16 |
| 6610167 | Method for fabricating a special-purpose die using a polymerizable tape | Steven Webster, Roy Dale Hollaway | 2003-08-26 |
| 6601293 | Method of making an electromagnetic interference shield device | — | 2003-08-05 |
| 6586677 | Plastic integrated circuit device package having exposed lead surface | — | 2003-07-01 |
| 6586824 | Reduced thickness packaged electronic device | Steven Webster, Roy Dale Hollaway | 2003-07-01 |