Issued Patents All Time
Showing 76–100 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6486545 | Pre-drilled ball grid array package | Steven Webster, Roy Dale Hollaway | 2002-11-26 |
| 6483030 | Snap lid image sensor package | Steven Webster | 2002-11-19 |
| 6476476 | Integrated circuit package including pin and barrel interconnects | — | 2002-11-05 |
| 6472758 | Semiconductor package including stacked semiconductor dies and bond wires | Lee Smith, David Zoba, Kambhampati Ramakrishna, Vincent DiCaprio | 2002-10-29 |
| 6472598 | Electromagnetic interference shield device with conductive encapsulant and dam | — | 2002-10-29 |
| 6465329 | Microcircuit die-sawing protector and method | — | 2002-10-15 |
| 6455927 | Micromirror device package | Steven Webster, Roy Dale Hollaway | 2002-09-24 |
| 6455356 | Methods for moding a leadframe in plastic integrated circuit devices | Scott Joseph Jewler, David Roman, J. H. Yee, D. H. Moon | 2002-09-24 |
| 6448635 | Surface acoustical wave flip chip | — | 2002-09-10 |
| 6448506 | Semiconductor package and circuit board for making the package | Steven Webster, Roy D. Holloway | 2002-09-10 |
| 6444499 | Method for fabricating a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components | Gary L. Swiss | 2002-09-03 |
| 6441485 | Apparatus for electrically mounting an electronic device to a substrate without soldering | — | 2002-08-27 |
| 6441504 | Precision aligned and marked structure | Steven Webster, Gary L. Swiss | 2002-08-27 |
| 6433277 | Plastic integrated circuit package and method and leadframe for making the package | — | 2002-08-13 |
| 6429515 | Long wire IC package | — | 2002-08-06 |
| 6429513 | Active heat sink for cooling a semiconductor chip | Charles A. Shermer, IV, Steven Webster, Donald C. Foster | 2002-08-06 |
| 6424031 | Stackable package with heat sink | — | 2002-07-23 |
| 6424315 | Semiconductor chip having a radio-frequency identification transceiver | Steven Webster | 2002-07-23 |
| 6420776 | Structure including electronic components singulated using laser cutting | Steven Webster, Roy Dale Hollaway | 2002-07-16 |
| 6420204 | Method of making a plastic package for an optical integrated circuit device | — | 2002-07-16 |
| 6415505 | Micromachine package fabrication method | — | 2002-07-09 |
| 6406934 | Wafer level production of chip size semiconductor packages | Steven Webster, Vincent DiCaprio | 2002-06-18 |
| 6407381 | Wafer scale image sensor package | Steven Webster, Tony Arellano | 2002-06-18 |
| 6404046 | Module of stacked integrated circuit packages including an interposer | Steven M. Anderson | 2002-06-11 |
| 6399463 | Method of singulation using laser cutting | Steven Webster, Roy Dale Hollaway | 2002-06-04 |