Issued Patents All Time
Showing 101–125 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6399418 | Method for forming a reduced thickness packaged electronic device | Steven Webster, Roy Dale Hollaway | 2002-06-04 |
| 6396043 | Thin image sensor package fabrication method | Steven Webster, Roy Dale Hollaway | 2002-05-28 |
| 6389687 | Method of fabricating image sensor packages in an array | Steven Webster | 2002-05-21 |
| 6342406 | Flip chip on glass image sensor package fabrication method | Steven Webster, Roy Dale Hollaway | 2002-01-29 |
| 6340846 | Making semiconductor packages with stacked dies and reinforced wire bonds | Anthony James LoBianco, Frank J. Juskey, Stephen G. Shermer, Vincent DiCaprio | 2002-01-22 |
| 6326235 | Long wire IC package fabrication method | — | 2001-12-04 |
| 6320251 | Stackable package for an integrated circuit | — | 2001-11-20 |
| 6309943 | Precision marking and singulation method | Steven Webster, Gary L. Swiss | 2001-10-30 |
| 6291884 | Chip-size semiconductor packages | Roy Dale Hollaway | 2001-09-18 |
| 6281568 | Plastic integrated circuit device package and leadframe having partially undercut leads and die pad | Scott Joseph Jewler, David Roman, J. H. Yee, D. H. Moon | 2001-08-28 |
| 6274927 | Plastic package for an optical integrated circuit device and method of making | — | 2001-08-14 |
| 6268654 | Integrated circuit package having adhesive bead supporting planar lid above planar substrate | Roy Dale Hollaway, Anthony E. Panczak | 2001-07-31 |
| 6266197 | Molded window array for image sensor packages | Steven Webster | 2001-07-24 |
| 6247229 | Method of forming an integrated circuit device package using a plastic tape as a base | — | 2001-06-19 |
| 6246566 | Electrostatic discharge protection package and method | — | 2001-06-12 |
| 6228676 | Near chip size integrated circuit package | Roy Dale Hollaway, Anthony E. Panczak | 2001-05-08 |
| 6214644 | Flip-chip micromachine package fabrication method | — | 2001-04-10 |
| 6150193 | RF shielded device | — | 2000-11-21 |
| 6143981 | Plastic integrated circuit package and method and leadframe for making the package | — | 2000-11-07 |
| 6143588 | Method of making an integrated circuit package employing a transparent encapsulant | — | 2000-11-07 |
| 6117193 | Optical sensor array mounting and alignment | — | 2000-09-12 |
| 6117705 | Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate | Roy Dale Hollaway, Anthony E. Panczak | 2000-09-12 |
| 6092281 | Electromagnetic interference shield driver and method | — | 2000-07-25 |
| 6034429 | Integrated circuit package | Roy Dale Hollaway, Anthony E. Panczak | 2000-03-07 |
| 5981314 | Near chip size integrated circuit package | Roy Dale Hollaway, Anthony E. Panczak | 1999-11-09 |