Issued Patents All Time
Showing 51–75 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6586677 | Plastic integrated circuit device package having exposed lead surface | — | 2003-07-01 |
| 6580153 | Structure for protecting a micromachine with a cavity in a UV tape | Roy Dale Hollaway, Steven Webster | 2003-06-17 |
| 6580167 | Heat spreader with spring IC package | Steven Webster, Roy Dale Hollaway | 2003-06-17 |
| 6577013 | Chip size semiconductor packages with stacked dies | Steven Webster, Vincent DiCaprio | 2003-06-10 |
| 6572944 | Structure for fabricating a special-purpose die using a polymerizable tape | Steven Webster, Roy Dale Hollaway | 2003-06-03 |
| 6571466 | Flip chip image sensor package fabrication method | Steven Webster, Roy Dale Hollaway | 2003-06-03 |
| 6566164 | Exposed copper strap in a semiconductor package | Blake A. Gillett | 2003-05-20 |
| 6564454 | Method of making and stacking a semiconductor package | Steven Webster, Roy D. Holloway | 2003-05-20 |
| 6563204 | Microcircuit die-sawing protector | — | 2003-05-13 |
| 6562655 | Heat spreader with spring IC package fabrication method | Steven Webster, Roy Dale Hollaway | 2003-05-13 |
| 6548759 | Pre-drilled image sensor package | Steven Webster, Roy Dale Hollaway | 2003-04-15 |
| 6545345 | Mounting for a package containing a chip | Steven Webster, Roy Dale Hollaway | 2003-04-08 |
| 6534876 | Flip-chip micromachine package | — | 2003-03-18 |
| 6532157 | Angulated semiconductor packages | Roy Dale Hollaway, Steven Webster | 2003-03-11 |
| 6530515 | Micromachine stacked flip chip package fabrication method | Steven Webster, Roy Dale Hollaway | 2003-03-11 |
| 6528875 | Vacuum sealed package for semiconductor chip | Roy Dale Hollaway, Steven Webster | 2003-03-04 |
| 6528869 | Semiconductor package with molded substrate and recessed input/output terminals | Roy Dale Hollaway | 2003-03-04 |
| 6528857 | Chip size image sensor bumped package | Steven Webster, Markus K. Liebhard | 2003-03-04 |
| 6526653 | Method of assembling a snap lid image sensor package | Steven Webster | 2003-03-04 |
| 6522015 | Micromachine stacked wirebonded package | Steven Webster, Roy Dale Hollaway | 2003-02-18 |
| 6521987 | Plastic integrated circuit device package and method for making the package | Scott Joseph Jewler, David Roman, Jae Hak Yee, Doo Hwan Moon | 2003-02-18 |
| 6518659 | Stackable package having a cavity and a lid for an electronic device | — | 2003-02-11 |
| 6509560 | Chip size image sensor in wirebond package with step-up ring for electrical contact | Steven Webster, Markus K. Liebhard | 2003-01-21 |
| 6503780 | Wafer scale image sensor package fabrication method | Steven Webster, Tony Arellano | 2003-01-07 |
| 6492699 | Image sensor package having sealed cavity over active area | Steven Webster | 2002-12-10 |