SJ

Scott Joseph Jewler

BN Bruker Nano: 5 patents #21 of 148Top 15%
AT Amkor Technology: 3 patents #206 of 595Top 35%
Globalfoundries: 2 patents #1,397 of 4,424Top 35%
MA Mitsubishi Semiconductor America: 2 patents #15 of 51Top 30%
AS Anam Semiconductor: 1 patents #24 of 53Top 50%
SV Svxr: 1 patents #5 of 5Top 100%
📍 Saratoga, CA: #704 of 2,933 inventorsTop 25%
🗺 California: #46,935 of 386,348 inventorsTop 15%
Overall (All Time): #371,933 of 4,157,543Top 9%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
11688067 Methods and systems for detecting defects in devices using X-rays David L. Adler, Freddie Erich Babian 2023-06-27
11662479 Methods and systems for printed circuit board design based on automatic corrections David L. Adler, Freddie Erich Babian 2023-05-30
11651492 Methods and systems for manufacturing printed circuit board based on x-ray inspection David L. Adler, Freddie Erich Babian, Andrew George Reid, Benjamin Thomas Adler 2023-05-16
11615533 Methods and systems for product failure prediction based on X-ray image re-examination David L. Adler, Douglas A. Chrissan 2023-03-28
11430118 Methods and systems for process control based on X-ray inspection David L. Adler 2022-08-30
11042981 Methods and systems for printed circuit board design based on automatic corrections David L. Adler, Freddie Erich Babian 2021-06-22
10192802 Thin film based fan out and multi die package platform 2019-01-29
9786574 Thin film based fan out and multi die package platform 2017-10-10
6521987 Plastic integrated circuit device package and method for making the package Thomas P. Glenn, David Roman, Jae Hak Yee, Doo Hwan Moon 2003-02-18
6455356 Methods for moding a leadframe in plastic integrated circuit devices Thomas P. Glenn, David Roman, J. H. Yee, D. H. Moon 2002-09-24
6281568 Plastic integrated circuit device package and leadframe having partially undercut leads and die pad Thomas P. Glenn, David Roman, J. H. Yee, D. H. Moon 2001-08-28
5790381 Integrated circuit package assembly Nour Eddine Derouiche 1998-08-04
5623395 Integrated circuit package assembly Nour Eddine Derouiche 1997-04-22