RH

Roy Dale Hollaway

AT Amkor Technology: 51 patents #7 of 595Top 2%
AE Amkor Electronics: 2 patents #10 of 35Top 30%
📍 Manila, AZ: #1 of 1 inventorsTop 100%
Overall (All Time): #47,864 of 4,157,543Top 2%
54
Patents All Time

Issued Patents All Time

Showing 1–25 of 54 patents

Patent #TitleCo-InventorsDate
7609461 Optical module having cavity substrate Steven Webster, Thomas P. Glenn 2009-10-27
7059040 Optical module with lens integral holder fabrication method Steven Webster, Thomas P. Glenn 2006-06-13
6967395 Mounting for a package containing a chip Thomas P. Glenn, Steven Webster 2005-11-22
6962829 Method of making near chip size integrated circuit package Thomas P. Glenn, Anthony E. Panczak 2005-11-08
6943429 Wafer having alignment marks extending from a first to a second surface of the wafer Thomas P. Glenn, Steven Webster 2005-09-13
6869861 Back-side wafer singulation method Thomas P. Glenn, Steven Webster 2005-03-22
6849916 Flip chip on glass sensor package Thomas P. Glenn, Steven Webster 2005-02-01
6816523 VCSEL package and fabrication method Thomas P. Glenn, Steven Webster 2004-11-09
6777789 Mounting for a package containing a chip Thomas P. Glenn, Steven Webster 2004-08-17
6765801 Optical track drain package Thomas P. Glenn 2004-07-20
6734419 Method for forming an image sensor package with vision die in lens housing Thomas P. Glenn, Steven Webster 2004-05-11
6730536 Pre-drilled image sensor package fabrication method Thomas P. Glenn, Steven Webster 2004-05-04
6717126 Method of fabricating and using an image sensor package with reflector Thomas P. Glenn, Steven Webster 2004-04-06
6686580 Image sensor package with reflector Thomas P. Glenn, Steven Webster 2004-02-03
6686588 Optical module with lens integral holder Steven Webster, Thomas P. Glenn 2004-02-03
6670698 Integrated circuit package mounting Thomas P. Glenn, Steven Webster 2003-12-30
6661080 Structure for backside saw cavity protection Thomas P. Glenn, Steven Webster 2003-12-09
6638789 Micromachine stacked wirebonded package fabrication method Thomas P. Glenn, Steven Webster 2003-10-28
6627864 Thin image sensor package Thomas P. Glenn, Steven Webster 2003-09-30
6627987 Ceramic semiconductor package and method for fabricating the package Thomas P. Glenn, Steven Webster 2003-09-30
6624921 Micromirror device package fabrication method Thomas P. Glenn, Steven Webster 2003-09-23
6610167 Method for fabricating a special-purpose die using a polymerizable tape Thomas P. Glenn, Steven Webster 2003-08-26
6586824 Reduced thickness packaged electronic device Thomas P. Glenn, Steven Webster 2003-07-01
6580167 Heat spreader with spring IC package Thomas P. Glenn, Steven Webster 2003-06-17
6580153 Structure for protecting a micromachine with a cavity in a UV tape Thomas P. Glenn, Steven Webster 2003-06-17