Issued Patents All Time
Showing 26–50 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6571466 | Flip chip image sensor package fabrication method | Thomas P. Glenn, Steven Webster | 2003-06-03 |
| 6572944 | Structure for fabricating a special-purpose die using a polymerizable tape | Thomas P. Glenn, Steven Webster | 2003-06-03 |
| 6562655 | Heat spreader with spring IC package fabrication method | Thomas P. Glenn, Steven Webster | 2003-05-13 |
| 6548759 | Pre-drilled image sensor package | Thomas P. Glenn, Steven Webster | 2003-04-15 |
| 6545345 | Mounting for a package containing a chip | Thomas P. Glenn, Steven Webster | 2003-04-08 |
| 6532157 | Angulated semiconductor packages | Thomas P. Glenn, Steven Webster | 2003-03-11 |
| 6530515 | Micromachine stacked flip chip package fabrication method | Thomas P. Glenn, Steven Webster | 2003-03-11 |
| 6528875 | Vacuum sealed package for semiconductor chip | Thomas P. Glenn, Steven Webster | 2003-03-04 |
| 6528869 | Semiconductor package with molded substrate and recessed input/output terminals | Thomas P. Glenn | 2003-03-04 |
| 6522015 | Micromachine stacked wirebonded package | Thomas P. Glenn, Steven Webster | 2003-02-18 |
| 6515269 | Integrally connected image sensor packages having a window support in contact with a window and the active area | Steven Webster, Tony Arellano | 2003-02-04 |
| 6512219 | Fabrication method for integrally connected image sensor packages having a window support in contact with the window and active area | Steven Webster, Tony Arellano | 2003-01-28 |
| 6486545 | Pre-drilled ball grid array package | Thomas P. Glenn, Steven Webster | 2002-11-26 |
| 6455927 | Micromirror device package | Thomas P. Glenn, Steven Webster | 2002-09-24 |
| 6420776 | Structure including electronic components singulated using laser cutting | Thomas P. Glenn, Steven Webster | 2002-07-16 |
| 6399463 | Method of singulation using laser cutting | Thomas P. Glenn, Steven Webster | 2002-06-04 |
| 6399418 | Method for forming a reduced thickness packaged electronic device | Thomas P. Glenn, Steven Webster | 2002-06-04 |
| 6396043 | Thin image sensor package fabrication method | Thomas P. Glenn, Steven Webster | 2002-05-28 |
| 6342406 | Flip chip on glass image sensor package fabrication method | Thomas P. Glenn, Steven Webster | 2002-01-29 |
| 6291884 | Chip-size semiconductor packages | Thomas P. Glenn | 2001-09-18 |
| 6268654 | Integrated circuit package having adhesive bead supporting planar lid above planar substrate | Thomas P. Glenn, Anthony E. Panczak | 2001-07-31 |
| 6228676 | Near chip size integrated circuit package | Thomas P. Glenn, Anthony E. Panczak | 2001-05-08 |
| 6117705 | Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate | Thomas P. Glenn, Anthony E. Panczak | 2000-09-12 |
| 6034429 | Integrated circuit package | Thomas P. Glenn, Anthony E. Panczak | 2000-03-07 |
| 5981314 | Near chip size integrated circuit package | Thomas P. Glenn, Anthony E. Panczak | 1999-11-09 |