| 9153543 |
Shielding technique for semiconductor package including metal lid and metalized contact area |
Marc Alan Mangrum |
2015-10-06 |
| 6962829 |
Method of making near chip size integrated circuit package |
Thomas P. Glenn, Roy Dale Hollaway |
2005-11-08 |
| 6268654 |
Integrated circuit package having adhesive bead supporting planar lid above planar substrate |
Thomas P. Glenn, Roy Dale Hollaway |
2001-07-31 |
| 6228676 |
Near chip size integrated circuit package |
Thomas P. Glenn, Roy Dale Hollaway |
2001-05-08 |
| 6117705 |
Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate |
Thomas P. Glenn, Roy Dale Hollaway |
2000-09-12 |
| 6034429 |
Integrated circuit package |
Thomas P. Glenn, Roy Dale Hollaway |
2000-03-07 |
| 5981314 |
Near chip size integrated circuit package |
Thomas P. Glenn, Roy Dale Hollaway |
1999-11-09 |
| 5950074 |
Method of making an integrated circuit package |
Thomas P. Glenn, Roy Dale Hollaway |
1999-09-07 |
| 5796163 |
Solder ball joint |
Thomas P. Glenn, Roy Dale Hollaway |
1998-08-18 |
| 5796586 |
Substrate board having an anti-adhesive solder mask |
Shaw Wei Lee, Poh Ling Lee |
1998-08-18 |
| 5620928 |
Ultra thin ball grid array using a flex tape or printed wiring board substrate and method |
Shaw Wei Lee, Jagdish G. Belani |
1997-04-15 |