Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5705851 | Thermal ball lead integrated package | Shahram Mostafazadeh, Satya Chillara | 1998-01-06 |
| 5650659 | Semiconductor component package assembly including an integral RF/EMI shield | Shahram Mostafazadeh, Satya Chillara | 1997-07-22 |
| 5644167 | Integrated circuit package assemblies including an electrostatic discharge interposer | Peter Weiler | 1997-07-01 |
| 5620928 | Ultra thin ball grid array using a flex tape or printed wiring board substrate and method | Shaw Wei Lee, Anthony E. Panczak | 1997-04-15 |
| 5046657 | Tape automated bonding of bumped tape on bumped die | Venkat Iyer, Hem Takiar, Rajenda Pendse | 1991-09-10 |
| 4912548 | Use of a heat pipe integrated with the IC package for improving thermal performance | Bangalore J. Shanker | 1990-03-27 |
| 4876587 | One-piece interconnection package and process | Robert E. Hilton, Ali Emamjomeh | 1989-10-24 |
| 4595480 | System for electroplating molded semiconductor devices | Hem Takiar | 1986-06-17 |
| 4486511 | Solder composition for thin coatings | Yung-Shih Chen, Vijay M. Sajja | 1984-12-04 |
| 4411735 | Polymeric insulation layer etching process and composition | — | 1983-10-25 |