Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5825084 | Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices | John Hon-Shing Lau, Tai-Yu Chou, Frank H. Wu, Kuan L. Chen, Wei Koh | 1998-10-20 |
| 4486511 | Solder composition for thin coatings | Jagdish G. Belani, Vijay M. Sajja | 1984-12-04 |