Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6519747 | Method and apparatus for defining signal timing for an integrated circuit device | Satyanarayana Nishtala, Jayarama N. Shenoy, Michael C. Freda | 2003-02-11 |
| 5825084 | Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices | John Hon-Shing Lau, Yung-Shih Chen, Frank H. Wu, Kuan L. Chen, Wei Koh | 1998-10-20 |
| 5691568 | Wire bondable package design with maxium electrical performance and minimum number of layers | Sanjay Dandia | 1997-11-25 |
| 5672911 | Apparatus to decouple core circuits power supply from input-output circuits power supply in a semiconductor device package | Sadanand R. Patil, Prabhansu Chakrabarti | 1997-09-30 |