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Boris Reynov, David K. Owen, Steve Wilkinson, Jing Zhang |
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Layer-layer registration coupon for printed circuit boards |
Stephanie Moran, Karl Sauter |
2018-05-01 |
| 9354270 |
Step drill test structure of layer depth sensing on printed circuit board |
Stephanie Moran, Karl Sauter |
2016-05-31 |
| 8923007 |
Multi-diameter unplugged component hole(s) on a printed circuit board (PCB) |
Michael F. Sweeney, Jorge E. Martinez-Vargas, JR. |
2014-12-30 |
| 8431831 |
Bond strength and interconnection in a via |
Michael F. Sweeney, Jorge E. Martinez-Vargas, JR. |
2013-04-30 |
| 8237058 |
Printed circuit board with low propagation skew between signal traces |
Ricki Williams |
2012-08-07 |
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Low inductance mount for decoupling capacitors |
Lawrence D. Smith |
2007-09-11 |
| 7162795 |
Power distribution system with a dedicated power structure and a high performance voltage regulator |
Larry D. Smith, Istvan Novak |
2007-01-16 |
| 6794581 |
Method and apparatus for distributing power to integrated circuits |
Larry D. Smith, Istvan Novak, Ali Hassanzadeh |
2004-09-21 |
| 6791846 |
Power distribution system with a dedicated power structure and a high performance voltage regulator |
Larry D. Smith, Istvan Novak |
2004-09-14 |
| 6760232 |
Power distribution system having a dedicated power structure with apertures for mounting integrated circuit packages |
Larry D. Smith, Ali Hassanzadeh |
2004-07-06 |
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Adding electrical resistance in series with bypass capacitors using annular resistors |
Istvan Novak, Valerie St.Cyr, Merle Tetreault |
2004-04-27 |
| 6534872 |
Apparatus and system with increased signal trace routing options in printed wiring boards and integrated circuit packaging |
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2003-03-18 |
| 6521846 |
Method for assigning power and ground pins in array packages to enhance next level routing |
Prabhansu Chakrabarti |
2003-02-18 |
| 6519747 |
Method and apparatus for defining signal timing for an integrated circuit device |
Satyanarayana Nishtala, Jayarama N. Shenoy, Tai-Yu Chou |
2003-02-11 |