Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5914528 | Thermally-enhanced lead frame with reduced thermal gap | Hem Takiar | 1999-06-22 |
| 5825084 | Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices | John Hon-Shing Lau, Yung-Shih Chen, Tai-Yu Chou, Frank H. Wu, Wei Koh | 1998-10-20 |