Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8635762 | Methods for manufacturing a radio frequency identification tag without aligning the chip and antenna | Nikhil Vishwanath Kelkar, Cheol Han | 2014-01-28 |
| 7846775 | Universal lead frame for micro-array packages | Shaw Wei Lee, Nghia Thuc Tu | 2010-12-07 |
| 7795126 | Electrical die contact structure and fabrication method | Ashok S. Prabhu, Shaw Wei Lee, Alexander H. Owens | 2010-09-14 |
| 7340181 | Electrical die contact structure and fabrication method | Ashok S. Prabhu, Shaw Wei Lee, Alexander H. Owens | 2008-03-04 |
| 7230580 | Design of a two interconnect IC chip for a radio frequency identification tag and method for manufacturing same | Nikhil Vishwanath Kelkar, Cheol Han | 2007-06-12 |
| 6933212 | Apparatus and method for dicing semiconductor wafers | Shaw Wei Lee, Nghia Thuc Tu, Visvamohan Yegnashankaran | 2005-08-23 |
| 6723585 | Leadless package | Nghia Thuc Tu, Shaw Wei Lee | 2004-04-20 |
| 5672911 | Apparatus to decouple core circuits power supply from input-output circuits power supply in a semiconductor device package | Tai-Yu Chou, Prabhansu Chakrabarti | 1997-09-30 |
| 5227663 | Integral dam and heat sink for semiconductor device assembly | Adrian Murphy, Keith Newman | 1993-07-13 |
| 5175612 | Heat sink for semiconductor device assembly | Jon M. Long, Mark R. Schneider | 1992-12-29 |