Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6117695 | Apparatus and method for testing a flip chip integrated circuit package adhesive layer | Manickam Thavarajah, Patrick Variot | 2000-09-12 |
| 5992242 | Silicon wafer or die strength test fixture using high pressure fluid | Manickam Thavarajah | 1999-11-30 |
| 5447229 | Cot/tab protective shipping apparatus and method | Brian Lynch, Patrick E. O'Brien | 1995-09-05 |
| 5227663 | Integral dam and heat sink for semiconductor device assembly | Sadanand R. Patil, Keith Newman | 1993-07-13 |
| 5173766 | Semiconductor device package and method of making such a package | Jon M. Long, Rachel S. Sidorovsky, Michael J. Steidl, Bidyut Sen | 1992-12-22 |