Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5814892 | Semiconductor die with staggered bond pads | Sanjay Dandia | 1998-09-29 |
| 5796171 | Progressive staggered bonding pads | Aydin Koc, Sanjay Dandia | 1998-08-18 |
| 5173766 | Semiconductor device package and method of making such a package | Jon M. Long, Rachel S. Sidorovsky, Adrian Murphy, Bidyut Sen | 1992-12-22 |
| 5104827 | Method of making a plastic-packaged semiconductor device having lead support and alignment structure | Mark R. Schneider | 1992-04-14 |
| 5051813 | Plastic-packaged semiconductor device having lead support and alignment structure | Mark R. Schneider | 1991-09-24 |
| 5023202 | Rigid strip carrier for integrated circuits | Jon M. Long | 1991-06-11 |