| 12475136 |
Transforming data using database, object oriented programming, and stored program concepts |
Aida Sadykova, Robert J. Long, Sandeep Reddy Vakiti |
2025-11-18 |
|
| 12055777 |
Integrated circuit package with electro-optical interconnect circuitry |
Peng Li, Joel Martinez |
2024-08-06 |
$17,070,000 |
| 11327259 |
Integrated circuit package with electro-optical interconnect circuitry |
Peng Li, Joel Martinez |
2022-05-10 |
$19,182,000 |
| 10212498 |
Integrated circuit device with field programmable optical array |
Mike Peng Li, Joel Martinez, Weiqi Ding, Sergey Shumarayev |
2019-02-19 |
|
| 10075189 |
Techniques for variable forward error correction |
Peng Li, Martin Langhammer |
2018-09-11 |
|
| 9698123 |
Apparatus for stacked electronic circuitry and associated methods |
Arifur Rahman, Yuanlin Xie |
2017-07-04 |
|
| 9608728 |
Integrated circuit device with field programmable optical array |
Mike Peng Li, Joel Martinez, Weiqi Ding, Sergey Shumarayev |
2017-03-28 |
|
| 9110128 |
IC package for pin counts less than test requirements |
— |
2015-08-18 |
$14,677,000 |
| 9040348 |
Electronic assembly apparatus and associated methods |
Nagesh Vodrahalli |
2015-05-26 |
$23,933,000 |
| 9002155 |
Integrated optical-electronic interface in programmable integrated circuit device |
Peng Li, Sergey Shumarayev, Tien Duc Pham |
2015-04-07 |
$17,520,000 |
| 8716876 |
Systems and methods for stacking a memory chip above an integrated circuit chip |
Richard G. Smolen |
2014-05-06 |
$5,057,000 |
| 8076761 |
Reduced inductance IC leaded package |
— |
2011-12-13 |
$38,117,000 |
| 7514789 |
Ball grid array package-to-board interconnect co-design apparatus |
Yuming Tao, Anilkumar Raman Pannikkat |
2009-04-07 |
$7,487,000 |
| 7405477 |
Ball grid array package-to-board interconnect co-design apparatus |
Yuming Tao, Anilkumar Raman Pannikkat |
2008-07-29 |
$7,581,000 |
| 7091613 |
Elongated bonding pad for wire bonding and sort probing |
Joseph W. Foerstel |
2006-08-15 |
$11,238,000 |
| 6914317 |
Thin microelectronic substrates and methods of manufacture |
Charles E. Larson, Timothy E. Murphy, Bryan L. Taylor, Mark W. Ellis, Vincent L. Riley |
2005-07-05 |
$1,616,000 |
| 6864565 |
Post-passivation thick metal pre-routing for flip chip packaging |
Vincent Hool |
2005-03-08 |
$39,989,000 |
| 6693342 |
Thin microelectronic substrates and methods of manufacture |
Charles E. Larson, Timothy E. Murphy, Bryan L. Taylor, Mark W. Ellis, Vincent L. Riley |
2004-02-17 |
$2,708,000 |
| 6407450 |
Semiconductor package with universal substrate for electrically interfacing with different sized chips that have different logic functions |
Tarun Verma, Larry Patrick Anderson, Bruce B. Pedersen |
2002-06-18 |
$30,348,000 |
| 6303469 |
Thin microelectronic substrates and methods of manufacture |
Charles E. Larson, Timothy E. Murphy, Bryan L. Taylor, Mark W. Ellis, Vincent L. Riley |
2001-10-16 |
$7,511,000 |
| 5831836 |
Power plane for semiconductor device |
John McCormick |
1998-11-03 |
$5,955,000 |
| 5408741 |
Method for forming electronic device |
— |
1995-04-25 |
$2,237,000 |
| 5407275 |
Non-destructive test for inner lead bond of a tab device |
— |
1995-04-18 |
$4,307,000 |
| 5349495 |
System for securing and electrically connecting a semiconductor chip to a substrate |
Thomas A. Visel |
1994-09-20 |
$1,308,000 |
| 5307559 |
Method of providing a capacitor within a semiconductor device package |
— |
1994-05-03 |
$12,729,000 |
