Issued Patents All Time
Showing 25 most recent of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12055777 | Integrated circuit package with electro-optical interconnect circuitry | Peng Li, Joel Martinez | 2024-08-06 |
| 11327259 | Integrated circuit package with electro-optical interconnect circuitry | Peng Li, Joel Martinez | 2022-05-10 |
| 10212498 | Integrated circuit device with field programmable optical array | Mike Peng Li, Joel Martinez, Weiqi Ding, Sergey Shumarayev | 2019-02-19 |
| 10075189 | Techniques for variable forward error correction | Peng Li, Martin Langhammer | 2018-09-11 |
| 9698123 | Apparatus for stacked electronic circuitry and associated methods | Arifur Rahman, Yuanlin Xie | 2017-07-04 |
| 9608728 | Integrated circuit device with field programmable optical array | Mike Peng Li, Joel Martinez, Weiqi Ding, Sergey Shumarayev | 2017-03-28 |
| 9110128 | IC package for pin counts less than test requirements | — | 2015-08-18 |
| 9040348 | Electronic assembly apparatus and associated methods | Nagesh Vodrahalli | 2015-05-26 |
| 9002155 | Integrated optical-electronic interface in programmable integrated circuit device | Peng Li, Sergey Shumarayev, Tien Duc Pham | 2015-04-07 |
| 8716876 | Systems and methods for stacking a memory chip above an integrated circuit chip | Richard G. Smolen | 2014-05-06 |
| 8076761 | Reduced inductance IC leaded package | — | 2011-12-13 |
| 7514789 | Ball grid array package-to-board interconnect co-design apparatus | Yuming Tao, Anilkumar Raman Pannikkat | 2009-04-07 |
| 7405477 | Ball grid array package-to-board interconnect co-design apparatus | Yuming Tao, Anilkumar Raman Pannikkat | 2008-07-29 |
| 7091613 | Elongated bonding pad for wire bonding and sort probing | Joseph W. Foerstel | 2006-08-15 |
| 6914317 | Thin microelectronic substrates and methods of manufacture | Charles E. Larson, Timothy E. Murphy, Bryan L. Taylor, Mark W. Ellis, Vincent L. Riley | 2005-07-05 |
| 6864565 | Post-passivation thick metal pre-routing for flip chip packaging | Vincent Hool | 2005-03-08 |
| 6693342 | Thin microelectronic substrates and methods of manufacture | Charles E. Larson, Timothy E. Murphy, Bryan L. Taylor, Mark W. Ellis, Vincent L. Riley | 2004-02-17 |
| 6407450 | Semiconductor package with universal substrate for electrically interfacing with different sized chips that have different logic functions | Tarun Verma, Larry Patrick Anderson, Bruce B. Pedersen | 2002-06-18 |
| 6303469 | Thin microelectronic substrates and methods of manufacture | Charles E. Larson, Timothy E. Murphy, Bryan L. Taylor, Mark W. Ellis, Vincent L. Riley | 2001-10-16 |
| 5831836 | Power plane for semiconductor device | John McCormick | 1998-11-03 |
| 5408741 | Method for forming electronic device | — | 1995-04-25 |
| 5407275 | Non-destructive test for inner lead bond of a tab device | — | 1995-04-18 |
| 5349495 | System for securing and electrically connecting a semiconductor chip to a substrate | Thomas A. Visel | 1994-09-20 |
| 5307559 | Method of providing a capacitor within a semiconductor device package | — | 1994-05-03 |
| 5304738 | System for protecting leads of a semiconductor chip package during testing, burn-in and handling | — | 1994-04-19 |