Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Systems and methods for stacking a memory chip above an integrated circuit chip

Systems and methods for stacking a memory chip above an integrated circuit chip

US Patent 8716876 · Granted May 6, 2014

Estimated economic value: $5,057,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Transforming data using database, object oriented programming, and stored progra2025
Integrated circuit package with electro-optical interconnect circuitry2024
Integrated circuit package with electro-optical interconnect circuitry2022
Methods and circuitry for programming non-volatile resistive switches using vari2020
Integrated circuits with programmable non-volatile resistive switch elements2019
Integrated circuits with complementary non-volatile resistive memory elements2019
Integrated circuit device with field programmable optical array2019
Integrated circuits with programmable non-volatile resistive switch elements2018
Techniques for variable forward error correction2018
Apparatus for stacked electronic circuitry and associated methods2017
Integrated circuit device with field programmable optical array2017
IC package for pin counts less than test requirements2015