Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9679861 | Integrated circuit package with active warpage control printed circuit board mount | — | 2017-06-13 |
| 9648728 | Coreless organic substrate | Susan Huang | 2017-05-09 |
| 9385060 | Integrated circuit package with enhanced thermal conduction | Minghao Shen | 2016-07-05 |
| 9368440 | Embedded coaxial wire and method of manufacture | — | 2016-06-14 |
| 8217500 | Semiconductor device package | — | 2012-07-10 |
| 7501709 | BGA package with wiring schemes having reduced current loop paths to improve cross talk control and characteristic impedance | Hong Shi, Yuanlin Xie, Tarun Verma | 2009-03-10 |
| 7391122 | Techniques for flip chip package migration | — | 2008-06-24 |
| 7276399 | Method of designing a module-based flip chip substrate design | John Y. Xie | 2007-10-02 |
| 7115988 | Bypass capacitor embedded flip chip package lid and stiffener | — | 2006-10-03 |
| 6864565 | Post-passivation thick metal pre-routing for flip chip packaging | Jon M. Long | 2005-03-08 |