Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7276399 | Method of designing a module-based flip chip substrate design | Vincent Hool | 2007-10-02 |
| 6034427 | Ball grid array structure and method for packaging an integrated circuit chip | James J. D. Lan, Steve S. Chiang, Paul Ying-Fung Wu, William H. Shepherd, Hang Jiang | 2000-03-07 |
| 5987744 | Method for supporting one or more electronic components | James J. D. Lan, Steve S. Chiang, Paul Ying-Fung Wu | 1999-11-23 |
| 5906042 | Method and structure to interconnect traces of two conductive layers in a printed circuit board | James J. D. Lan, Steve S. Chiang, William H. Shepherd, Paul Ying-Fung Wu | 1999-05-25 |
| 5872338 | Multilayer board having insulating isolation rings | James J. D. Lan, Steve S. Chiang, Paul Ying-Fung Wu | 1999-02-16 |
| 5834824 | Use of conductive particles in a nonconductive body as an integrated circuit antifuse | William H. Shepherd, Steve S. Chiang | 1998-11-10 |
| 5767575 | Ball grid array structure and method for packaging an integrated circuit chip | James J. D. Lan, Steve S. Chiang, Paul Ying-Fung Wu, William H. Shepherd, Hang Jiang | 1998-06-16 |