Issued Patents All Time
Showing 25 most recent of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7671428 | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates | Satyadev Patel, Andrew Huibers | 2010-03-02 |
| 7655492 | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates | Satyadev Patel, Andrew Huibers | 2010-02-02 |
| 7586668 | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates | Satyadev Patel, Andrew Huibers | 2009-09-08 |
| 7573111 | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates | Satyadev Patel, Andrew Huibers | 2009-08-11 |
| 7449358 | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates | Satyadev Patel, Andrew Huibers | 2008-11-11 |
| 7307775 | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates | Satayadev Patel, Andrew Huibers, Robert M. Duboc, Jr., Thomas J. Grobelny, Hung-Nan Chen +4 more | 2007-12-11 |
| 7286278 | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates | Satyadev Patel, Andrew Huibers | 2007-10-23 |
| 7198982 | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates | Satyadev Patel, Andrew Huibers | 2007-04-03 |
| 6995034 | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates | Satyadev Patel, Andrew Huibers | 2006-02-07 |
| 6995040 | Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates | Satyadev Patel, Andrew Huibers | 2006-02-07 |
| 6603187 | Antifuse structure suitable for VLSI application | Guobiao ZHANG, Chenming Hu | 2003-08-05 |
| 6111302 | Antifuse structure suitable for VLSI application | Guobiao ZHANG, Chenming Hu | 2000-08-29 |
| 6034427 | Ball grid array structure and method for packaging an integrated circuit chip | James J. D. Lan, Paul Ying-Fung Wu, William H. Shepherd, John Y. Xie, Hang Jiang | 2000-03-07 |
| 5987744 | Method for supporting one or more electronic components | James J. D. Lan, Paul Ying-Fung Wu, John Y. Xie | 1999-11-23 |
| 5962815 | Antifuse interconnect between two conducting layers of a printed circuit board | James J. D. Lan, William H. Shepherd, Paul Ying-Fung Wu | 1999-10-05 |
| 5917229 | Programmable/reprogrammable printed circuit board using fuse and/or antifuse as interconnect | Richard J. Nathan, James J. D. Lan | 1999-06-29 |
| 5906042 | Method and structure to interconnect traces of two conductive layers in a printed circuit board | James J. D. Lan, William H. Shepherd, Paul Ying-Fung Wu, John Y. Xie | 1999-05-25 |
| 5906043 | Programmable/reprogrammable structure using fuses and antifuses | James J. D. Lan, William H. Shepherd, Paul Ying-Fung Wu | 1999-05-25 |
| 5872338 | Multilayer board having insulating isolation rings | James J. D. Lan, Paul Ying-Fung Wu, John Y. Xie | 1999-02-16 |
| 5856234 | Method of fabricating an antifuse | Wenn-Jei Chen | 1999-01-05 |
| 5834824 | Use of conductive particles in a nonconductive body as an integrated circuit antifuse | William H. Shepherd, John Y. Xie | 1998-11-10 |
| 5825072 | Circuits for ESD Protection of metal to-metal antifuses during processing | Yeochung Yen, Wenn-Jei Chen, Abdul Rahim Forouhi | 1998-10-20 |
| 5813881 | Programmable cable and cable adapter using fuses and antifuses | Richard J. Nathan, James J. D. Lan | 1998-09-29 |
| 5808351 | Programmable/reprogramable structure using fuses and antifuses | Richard J. Nathan, James J. D. Lan, William H. Shepherd | 1998-09-15 |
| 5767575 | Ball grid array structure and method for packaging an integrated circuit chip | James J. D. Lan, Paul Ying-Fung Wu, William H. Shepherd, John Y. Xie, Hang Jiang | 1998-06-16 |