| 9893034 |
Integrated circuit packages with detachable interconnect structures |
— |
2018-02-13 |
| 9842813 |
Tranmission line bridge interconnects |
Xiaohong Jiang |
2017-12-12 |
| 9748197 |
Methods for packaging integrated circuits |
Loon Kwang Tan, Ping Chet Tan |
2017-08-29 |
| 9698123 |
Apparatus for stacked electronic circuitry and associated methods |
Arifur Rahman, Jon M. Long |
2017-07-04 |
| 9673173 |
Integrated circuit package with embedded passive structures |
Zhe Li |
2017-06-06 |
| 9570342 |
Via structure and method for its fabrication |
— |
2017-02-14 |
| 9559036 |
Integrated circuit package with plated heat spreader |
Steven H. C. Hsieh |
2017-01-31 |
| 9536820 |
Power distribution network |
Hui Liu, Hong Shi |
2017-01-03 |
| 9462691 |
Enhanced ball grid array |
— |
2016-10-04 |
| 9418965 |
Embedded interposer with through-hole vias |
Zhe Li |
2016-08-16 |
| 9401287 |
Methods for packaging integrated circuits |
Loon Kwang Tan, Ping Chet Tan |
2016-07-26 |
| 9401330 |
IC package with non-uniform dielectric layer thickness |
Xiaohong Jiang, Hong Shi, Hui Liu |
2016-07-26 |
| 9196575 |
Integrated circuit package with cavity in substrate |
Myung June Lee, Yuan-Liang Li |
2015-11-24 |
| 8710643 |
Electronic package with fluid flow barriers |
Teck-Gyu Kang, Yuan-Liang Li |
2014-04-29 |
| 8498129 |
Power distribution network |
Hui Liu, Hong Shi |
2013-07-30 |
| 8242608 |
Universal bump array structure |
Li-Tien Chang |
2012-08-14 |
| 8198699 |
Integrated circuit package with non-solder mask defined like pads |
Yuan-Liang Li |
2012-06-12 |
| 7936059 |
Lead frame packaging technique with reduced noise and cross-talk |
— |
2011-05-03 |
| 7883937 |
Electronic package and method of forming the same |
Teck-Gyu Kang, Yuan-Liang Li |
2011-02-08 |
| 7501709 |
BGA package with wiring schemes having reduced current loop paths to improve cross talk control and characteristic impedance |
Vincent Hool, Hong Shi, Tarun Verma |
2009-03-10 |
| 7472367 |
Method of optimizing interconnect distribution to improve signal integrity |
Hong Shi |
2008-12-30 |
| 7405473 |
Techniques for optimizing electrical performance and layout efficiency in connectors with via placement and routing |
Hong Shi |
2008-07-29 |
| 7309912 |
On-package edge-mount power decoupling and implementation with novel substrate design for FPGA and ASIC devices |
Hong Shi, Tarun Verma |
2007-12-18 |
| 7262079 |
Consolidated flip chip BGA assembly process and apparatus |
— |
2007-08-28 |