Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191280 | Ceramic carrier and build up carrier for light-emitting diode (LED) array | Tze Yang Hin | 2025-01-07 |
| 11664347 | Ceramic carrier and build up carrier for light-emitting diode (LED) array | Tze Yang Hin | 2023-05-30 |
| 9748197 | Methods for packaging integrated circuits | Yuanlin Xie, Ping Chet Tan | 2017-08-29 |
| 9425174 | Integrated circuit package with solderless interconnection structure | Tze Yang Hin, Chew Ching Lim | 2016-08-23 |
| 9401287 | Methods for packaging integrated circuits | Yuanlin Xie, Ping Chet Tan | 2016-07-26 |
| 9337240 | Integrated circuit package with a universal lead frame | Guan Khai Lee, Ping Chet Tan, Pheak Ti Teh | 2016-05-10 |
| 8541263 | Thermoset molding for on-package decoupling in flip chips | Teik Tiong Toong | 2013-09-24 |
| 8525326 | IC package with capacitors disposed on an interposal layer | Teik Tiong Toong | 2013-09-03 |
| 7989942 | IC package with capacitors disposed on an interposal layer | Teik Tiong Toong | 2011-08-02 |