Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11521940 | Stiffener for die crack prevention in semiconductor packages | Eng Kwong Lee | 2022-12-06 | $14,727,000 |
| 11495514 | Bathtub integrated heat spreader with multiple thermal-interface material for integrated-circuit packages | Chun Howe Sim | 2022-11-08 | $15,080,000 |
| 9633874 | Package substrate warpage reshaping apparatus and method | Ken Beng Lim | 2017-04-25 | |
| 9425174 | Integrated circuit package with solderless interconnection structure | Tze Yang Hin, Loon Kwang Tan | 2016-08-23 |