Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D906501 | Air purifier | — | 2020-12-29 |
| 9633874 | Package substrate warpage reshaping apparatus and method | Chew Ching Lim | 2017-04-25 |
| 9330997 | Heat spreading structures for integrated circuits | Myung June Lee, Yuan-Liang Li, Ping Chet Tan | 2016-05-03 |
| 9076776 | Integrated circuit package with stand-off legs | Ping Chet Tan | 2015-07-07 |
| 9054077 | Package having spaced apart heat sink | Teik Tiong Toong | 2015-06-09 |
| 8598698 | Package substrate with an embedded stiffener | — | 2013-12-03 |