Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189593 | Integrated device package | Mike Anderson | 2021-11-30 |
| 11083089 | Integrated device package | Sok Mun Chew, Chern Beng Kang | 2021-08-03 |
| 9601419 | Stacked leadframe packages | Chong Poh Lim | 2017-03-21 |
| 9054077 | Package having spaced apart heat sink | Ken Beng Lim | 2015-06-09 |
| 8786080 | Systems including an I/O stack and methods for fabricating such systems | Chooi Pei Lim, Jordan Plofsky, Yee Liang Tan | 2014-07-22 |
| 8541263 | Thermoset molding for on-package decoupling in flip chips | Loon Kwang Tan | 2013-09-24 |
| 8525326 | IC package with capacitors disposed on an interposal layer | Loon Kwang Tan | 2013-09-03 |
| 7989942 | IC package with capacitors disposed on an interposal layer | Loon Kwang Tan | 2011-08-02 |