Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package substrate warpage reshaping apparatus and method

Package substrate warpage reshaping apparatus and method

US Patent 9633874 · Granted Apr 25, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Stiffener for die crack prevention in semiconductor packages2022
Bathtub integrated heat spreader with multiple thermal-interface material for in2022
Air purifier2020
Integrated circuit package with solderless interconnection structure2016
Heat spreading structures for integrated circuits2016
Integrated circuit package with stand-off legs2015
Package having spaced apart heat sink2015
Package substrate with an embedded stiffener2013