Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521911 | Conformable heat sink pedestal for multi-chip packages | Tung Lun Loo | 2022-12-06 |
| 11521940 | Stiffener for die crack prevention in semiconductor packages | Chew Ching Lim | 2022-12-06 |