Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780040 | Integrated circuit package substrates having a common die dependent region and methods for designing the same | Siow Chek Tan, Swee Fong Chong | 2017-10-03 |
| 9337240 | Integrated circuit package with a universal lead frame | Guan Khai Lee, Loon Kwang Tan, Ping Chet Tan | 2016-05-10 |