Patents per Year
Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11043484 | Method and apparatus of package enabled ESD protection | Hong Shi, James Karp, Martin L. Voogel, Mohsen H. Mardi, Suresh Ramalingam +1 more | 2021-06-22 | $31,440,000 |
| 10770364 | Chip scale package (CSP) including shim die | Hong Shi, Suresh Ramalingam, Gamal Refai-Ahmed | 2020-09-08 | $91,207,000 |
| 10314163 | Low crosstalk vertical connection interface | Hong Shi | 2019-06-04 | $117,962,000 |
| 10057976 | Power-ground co-reference transceiver structure to deliver ultra-low crosstalk | Hong Shi, Sarajuddin Niazi | 2018-08-21 | $34,808,000 |
| 9780040 | Integrated circuit package substrates having a common die dependent region and methods for designing the same | Swee Fong Chong, Pheak Ti Teh | 2017-10-03 |