Hong Shi has been granted 10 US patents while listed as an inventor at AMD . The first was granted in 2018 and the most recent in July 2025. Hong Shi ranks #481,000 of 4,157,543 US inventors in our database (top 11.6%). Patent records list Hong Shi in Los Gatos, CA, US.
Patents per Year Patents granted per year, 2018 to 2025 Bar chart with a peak of 2 patents in 2023. peak 2 2018: 1 patents 2018 2019: 1 patents 2019 2020: 1 patents 2020 2021: 1 patents 2021 2022: 1 patents 2022 2023: 2 patents 2023 2024: 2 patents 2024 2025: 1 patents 2025
Issued Patents All Time
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Showing 1–10 of 10 patents
Patent # Title Co-Inventors Date Approx Value ⓘ
12354978 Coupled loop and void structure integrated in a redistribution layer of a chip package Po-Wei Chiu , Tzu-No Chen , Li-Sheng Weng , Young-Soo Lee 2025-07-08
12136613 Chip package with near-die integrated passive device Li-Sheng Weng , Suresh Ramalingam 2024-11-05
11950358 Integrated circuit package with voltage droop mitigation Frank Lambrecht , Brian D. Philofsky , Prasun K. Raha 2024-04-02
11735519 In-package passive inductive element for reflection mitigation Zhaoyin D. Wu , Parag Upadhyaya 2023-08-22
11688675 Core cavity noise isolation structure for use in chip packages Frank Lambrecht , Po-Wei Chiu 2023-06-27
11302674 Modular stacked silicon package assembly Jaspreet S. Gandhi , Suresh Ramalingam , William E. Allaire , Kerry M. Pierce 2022-04-12
11043484 Method and apparatus of package enabled ESD protection James Karp , Siow Chek Tan , Martin L. Voogel , Mohsen H. Mardi , Suresh Ramalingam +1 more 2021-06-22
$31,440,000
10770364 Chip scale package (CSP) including shim die Suresh Ramalingam , Siow Chek Tan , Gamal Refai-Ahmed 2020-09-08
$91,207,000
10314163 Low crosstalk vertical connection interface Siow Chek Tan 2019-06-04
$117,962,000
10057976 Power-ground co-reference transceiver structure to deliver ultra-low crosstalk Siow Chek Tan , Sarajuddin Niazi 2018-08-21
$34,808,000
