Issued Patents All Time
Showing 25 most recent of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11950358 | Integrated circuit package with voltage droop mitigation | Brian D. Philofsky, Hong Shi, Prasun K. Raha | 2024-04-02 |
| 11688675 | Core cavity noise isolation structure for use in chip packages | Po-Wei Chiu, Hong Shi | 2023-06-27 |
| 10692842 | Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2020-06-23 |
| 10643977 | Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2020-05-05 |
| 10503275 | Computing interface system | Eric Jeffrey Keller, Vinh Vi Lam | 2019-12-10 |
| 10090280 | Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2018-10-02 |
| 10032752 | Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2018-07-24 |
| 9679838 | Stub minimization for assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2017-06-13 |
| 9679876 | Microelectronic package having at least two microelectronic elements that are horizontally spaced apart from each other | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2017-06-13 |
| 9530458 | Stub minimization using duplicate sets of signal terminals | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2016-12-27 |
| 9515053 | Microelectronic packaging without wirebonds to package substrate having terminals with signal assignments that mirror each other with respect to a central axis | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2016-12-06 |
| 9496243 | Microelectronic assembly with opposing microelectronic packages each having terminals with signal assignments that mirror each other with respect to a central axis | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2016-11-15 |
| 9437579 | Multiple die face-down stacking for two or more die | Belgacem Haba, Wael Zohni, Richard Dewitt Crisp, Ilyas Mohammed | 2016-09-06 |
| 9423824 | Stub minimization for multi-die wirebond assemblies with parallel windows | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2016-08-23 |
| 9377824 | Microelectronic assembly including memory packages connected to circuit panel, the memory packages having stub minimization for wirebond assemblies without windows | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2016-06-28 |
| 9373565 | Stub minimization for assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2016-06-21 |
| 9287195 | Stub minimization using duplicate sets of terminals having modulo-x symmetry for wirebond assemblies without windows | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2016-03-15 |
| 9281271 | Stub minimization using duplicate sets of signal terminals having modulo-x symmetry in assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2016-03-08 |
| 9224431 | Stub minimization using duplicate sets of signal terminals | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2015-12-29 |
| 9013033 | Multiple die face-down stacking for two or more die | Belgacem Haba, Wael Zohni, Richard Dewitt Crisp, Ilyas Mohammed | 2015-04-21 |
| 8981547 | Stub minimization for multi-die wirebond assemblies with parallel windows | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2015-03-17 |
| 8743052 | Computing interface system | Eric Jeffrey Keller, Vinh Vi Lam | 2014-06-03 |
| 8670261 | Stub minimization using duplicate sets of signal terminals | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2014-03-11 |
| 8659142 | Stub minimization for wirebond assemblies without windows | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2014-02-25 |
| 8659139 | Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate | Richard Dewitt Crisp, Wael Zohni, Belgacem Haba | 2014-02-25 |