Issued Patents All Time
Showing 25 most recent of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12324101 | Frame for coupling of a thermal management device to a printed circuit board | Gamal Refai-Ahmed, Aslam Yehia, Chi-Yi Chao, Md Malekkul ISLAM, Hoa Do | 2025-06-03 |
| 12315781 | Heat spreader for a semiconductor package | Gamal Refai-Ahmed | 2025-05-27 |
| 12136613 | Chip package with near-die integrated passive device | Li-Sheng Weng, Hong Shi | 2024-11-05 |
| 12027493 | Fanout integration for stacked silicon package assembly | Jaspreet S. Gandhi | 2024-07-02 |
| 11769710 | Heterogeneous integration module comprising thermal management apparatus | Gamal Refai-Ahmed, Ken Chang, Mayank Raj, Chuan Xie, Yohan Frans | 2023-09-26 |
| 11605886 | Radome with integrated passive cooling | Gamal Refai-Ahmed, Chi-Yi Chao, Lik Tsang, Jens Weis, Brendan Farley +1 more | 2023-03-14 |
| 11488936 | Stacked silicon package assembly having vertical thermal management | Gamal Refai-Ahmed, Jaspreet S. Gandhi, Cheang-Whang Chang | 2022-11-01 |
| 11488887 | Thermal enablement of dies with impurity gettering | Gamal Refai-Ahmed, Boon Yong Ang, Toshiyuki Hisamura, Suresh Parameswaran, Scott McCann +1 more | 2022-11-01 |
| 11476556 | Remote active cooling heat exchanger and antenna system with the same | Mohsen H. Mardi, Gamal Refai-Ahmed, Volker Aue | 2022-10-18 |
| 11373929 | Thermal heat spreader plate for electronic device | Gamal Refai-Ahmed, Chi-Yi Chao, Hoa Do, Anthony Torza, Brian D. Philofsky +1 more | 2022-06-28 |
| 11373989 | Package integration for laterally mounted IC dies with dissimilar solder interconnects | Jaspreet S. Gandhi | 2022-06-28 |
| 11355412 | Stacked silicon package assembly having thermal management | Jaspreet S. Gandhi, Gamal Refai-Ahmed, Henley Liu, Myongseob Kim, Tien-Yu Lee +1 more | 2022-06-07 |
| 11328976 | Three-dimensional thermal management apparatuses for electronic devices | Gamal Refai-Ahmed, Chi-Yi Chao, Hoa Do, Anthony Torza, Brian D. Philofsky | 2022-05-10 |
| 11330738 | Force balanced package mounting | Gamal Refai-Ahmed, Chi-Yi Chao, Huayan Wang, Volker Aue | 2022-05-10 |
| 11315858 | Chip package assembly with enhanced solder resist crack resistance | Yu-Hsiang Sun, Tien-Yu Lee, Jaspreet S. Gandhi | 2022-04-26 |
| 11302674 | Modular stacked silicon package assembly | Jaspreet S. Gandhi, William E. Allaire, Hong Shi, Kerry M. Pierce | 2022-04-12 |
| 11282775 | Chip package assembly with stress decoupled interconnect layer | Jaspreet S. Gandhi | 2022-03-22 |
| 11246211 | Micro device with through PCB cooling | Gamal Refai-Ahmed, Nagadeven Karunakaran, Hoa Do | 2022-02-08 |
| 11217550 | Chip package assembly with enhanced interconnects and method for fabricating the same | Jaspreet S. Gandhi | 2022-01-04 |
| 11195780 | Stacked silicon package assembly having thermal management using phase change material | Jaspreet S. Gandhi, Gamal Refai-Ahmed | 2021-12-07 |
| 11145566 | Stacked silicon package assembly having thermal management | Gamal Refai-Ahmed, Jaspreet S. Gandhi, Cheang-Whang Chang | 2021-10-12 |
| 11107770 | Integrated electrical/optical interface with two-tiered packaging | Kun-Yung Chang, Yohan Frans, Chuan Xie, Mayank Raj | 2021-08-31 |
| 11043484 | Method and apparatus of package enabled ESD protection | Hong Shi, James Karp, Siow Chek Tan, Martin L. Voogel, Mohsen H. Mardi +1 more | 2021-06-22 |
| 10770364 | Chip scale package (CSP) including shim die | Hong Shi, Siow Chek Tan, Gamal Refai-Ahmed | 2020-09-08 |
| 10720377 | Electronic device apparatus with multiple thermally conductive paths for heat dissipation | Gamal Refai-Ahmed, Ho Hyung Lee, Hui-Wen Lin, Henley Liu | 2020-07-21 |