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Thermal enablement of dies with impurity gettering |
Gamal Refai-Ahmed, Suresh Ramalingam, Boon Yong Ang, Toshiyuki Hisamura, Scott McCann +1 more |
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Test vehicle for package testing |
Yuqing Gong, Boon Yong Ang |
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Systems and methods for on-die heat generation and temperature sensing |
Boon Yong Ang, Sarayanan Balakrishnan |
2020-04-14 |
| 10302504 |
On-die temperature sensing and digitization system |
Boon Yong Ang, Ankur Jain |
2019-05-28 |
| 10262911 |
Circuit for and method of testing bond connections between a first die and a second die |
Yuqing Gong, Henley Liu, Myongseob Kim, Cheang-Whang Chang, Boon Yong Ang |
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Method of testing a semiconductor structure |
Yuqing Gong, Henley Liu, Myongseob Kim, Cheang-Whang Chang, Boon Yong Ang |
2014-08-19 |
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Circuits and methods for programming integrated circuit input and output impedances |
Joseph Tzou, Morgan Whately, Thinh Tran |
2011-10-18 |
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Circuit and method for cascading programmable impedance matching in a multi-chip system |
Joseph Tzou, Thinh Tran |
2010-06-01 |
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Memory having read disturb test mode |
Joseph Tzou, Thinh Tran |
2010-05-18 |
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Configurable data path architecture and clocking scheme |
Thinh Tran |
2009-05-19 |
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Single late-write for standard synchronous SRAMs |
Thinh Tran, Joseph Tzou |
2008-07-22 |
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Memory interface system and method for reducing cycle time of sequential read and write accesses using separate address and data buses |
Thinh Tran, Joseph Tzou |
2006-11-28 |