Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11073550 | Test vehicle for package testing | Suresh Parameswaran, Boon Yong Ang | 2021-07-27 |
| 10262911 | Circuit for and method of testing bond connections between a first die and a second die | Henley Liu, Myongseob Kim, Suresh Parameswaran, Cheang-Whang Chang, Boon Yong Ang | 2019-04-16 |
| 8810269 | Method of testing a semiconductor structure | Henley Liu, Myongseob Kim, Suresh Parameswaran, Cheang-Whang Chang, Boon Yong Ang | 2014-08-19 |