| 12383225 |
Intravascular ultrasound patient interface module (PIM) for distributed wireless intraluminal imaging systems |
Nicolas Wonkeun Hyun, Yannick Marama KUO |
2025-08-12 |
| 12324101 |
Frame for coupling of a thermal management device to a printed circuit board |
Gamal Refai-Ahmed, Suresh Ramalingam, Aslam Yehia, Chi-Yi Chao, Md Malekkul ISLAM |
2025-06-03 |
| 12112850 |
Functional measurement patient interface module (PIM) for distributed wireless intraluminal sensing systems |
Yannick Marama KUO, Nicolas Wonkeun Hyun |
2024-10-08 |
| 11950954 |
Intravascular ultrasound patient interface module (PIM) for distributed wireless intraluminal imaging systems |
Nicolas Wonkeun Hyun, Yannick Marama KUO |
2024-04-09 |
| 11488887 |
Thermal enablement of dies with impurity gettering |
Gamal Refai-Ahmed, Suresh Ramalingam, Boon Yong Ang, Toshiyuki Hisamura, Suresh Parameswaran +1 more |
2022-11-01 |
| 11373929 |
Thermal heat spreader plate for electronic device |
Gamal Refai-Ahmed, Chi-Yi Chao, Suresh Ramalingam, Anthony Torza, Brian D. Philofsky +1 more |
2022-06-28 |
| 11328976 |
Three-dimensional thermal management apparatuses for electronic devices |
Gamal Refai-Ahmed, Chi-Yi Chao, Suresh Ramalingam, Anthony Torza, Brian D. Philofsky |
2022-05-10 |
| 11246211 |
Micro device with through PCB cooling |
Gamal Refai-Ahmed, Nagadeven Karunakaran, Suresh Ramalingam |
2022-02-08 |
| 6744131 |
Flip chip integrated circuit packages accommodating exposed chip capacitors while providing structural rigidity |
Lan H. Hoang, Leilei Zhang |
2004-06-01 |