Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
SH

Steven H. C. Hsieh — 8 Patents

AMD: 6 patents #2,147 of 9,280Top 25%
VTVlsi Technology: 1 patents #349 of 594Top 60%
Intel: 1 patents #18,326 of 30,777Top 60%
Cupertino, CA: #1,954 of 6,989 inventorsTop 30%
California: #74,834 of 386,348 inventorsTop 20%
Overall (All Time): #600,572 of 4,157,543Top 15%
8 Patents All Time
Steven H. C. Hsieh has been granted 8 US patents while listed as an inventor at AMD. The first was granted in 1995 and the most recent in January 2017. Steven H. C. Hsieh ranks #600,572 of 4,157,543 US inventors in our database (top 14.4%). Patent records list Steven H. C. Hsieh in Cupertino, CA, US.

Patents per Year

Patents granted per year, 1995 to 2017Bar chart with a peak of 2 patents in 2005.peak 21995: 1 patents19952003: 1 patents20032005: 2 patents20052006: 1 patents20062007: 1 patents20072008: 1 patents20082017: 1 patents2017

Issued Patents All Time

Showing 1–8 of 8 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
9559036 Integrated circuit package with plated heat spreader Yuanlin Xie 2017-01-31
7429501 Lid and method of employing a lid on an integrated circuit Paul Ying-Fung Wu, Soon-Shin Chee 2008-09-30 $4,572,000
7257511 Methods and circuits for measuring the thermal resistance of a packaged IC Siuki Chan 2007-08-14 $22,431,000
7012326 Lid and method of employing a lid on an integrated circuit Paul Ying-Fung Wu, Soon-Shin Chee 2006-03-14 $29,984,000
6895566 Methods and apparatus for isolating critical paths on an IC device having a thermal energy generator Siuki Chan 2005-05-17 $34,122,000
6847010 Methods and circuits for measuring the thermal resistance of a packaged IC Siuki Chan 2005-01-25 $9,535,000
6564986 Method and assembly for testing solder joint fractures between integrated circuit package and printed circuit board 2003-05-20 $32,517,000
5477138 Apparatus and method for testing the calibration of a variety of electronic package lead inspection systems Scott A. Erjavic 1995-12-19 $6,407,000