SH

Steven H. C. Hsieh

AM AMD: 6 patents #1,863 of 9,279Top 25%
VT Vlsi Technology: 1 patents #349 of 594Top 60%
IN Intel: 1 patents #18,218 of 30,777Top 60%
Overall (All Time): #641,878 of 4,157,543Top 20%
8
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9559036 Integrated circuit package with plated heat spreader Yuanlin Xie 2017-01-31
7429501 Lid and method of employing a lid on an integrated circuit Paul Ying-Fung Wu, Soon-Shin Chee 2008-09-30
7257511 Methods and circuits for measuring the thermal resistance of a packaged IC Siuki Chan 2007-08-14
7012326 Lid and method of employing a lid on an integrated circuit Paul Ying-Fung Wu, Soon-Shin Chee 2006-03-14
6895566 Methods and apparatus for isolating critical paths on an IC device having a thermal energy generator Siuki Chan 2005-05-17
6847010 Methods and circuits for measuring the thermal resistance of a packaged IC Siuki Chan 2005-01-25
6564986 Method and assembly for testing solder joint fractures between integrated circuit package and printed circuit board 2003-05-20
5477138 Apparatus and method for testing the calibration of a variety of electronic package lead inspection systems Scott A. Erjavic 1995-12-19