Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8178962 | Semiconductor device package and methods of manufacturing the same | Paul Ying-Fung Wu | 2012-05-15 |
| 7880265 | Packaged integrated circuit | Ann Chiuchin Lin | 2011-02-01 |
| 7872346 | Power plane and land pad feature to prevent human metal electrostatic discharge damage | Eugene O'Rourke | 2011-01-18 |
| 7605460 | Method and apparatus for a power distribution system | Paul Ying-Fung Wu | 2009-10-20 |
| 7429501 | Lid and method of employing a lid on an integrated circuit | Paul Ying-Fung Wu, Steven H. C. Hsieh | 2008-09-30 |
| 7294904 | Integrated circuit package with improved return loss | Ann Chiuchin Lin | 2007-11-13 |
| 7098075 | Integrated circuit and method of producing a carrier wafer for an integrated circuit | Alelie Funcell, Abhay Maheshwari | 2006-08-29 |
| 7012326 | Lid and method of employing a lid on an integrated circuit | Paul Ying-Fung Wu, Steven H. C. Hsieh | 2006-03-14 |
| 6657133 | Ball grid array chip capacitor structure | — | 2003-12-02 |