| 8379514 |
Route reflector for a communication system |
Michael John Rogan |
2013-02-19 |
| 8023406 |
Route reflector for a communication system |
Michael John Rogan |
2011-09-20 |
| 6774161 |
Process for the cold molding of particulate materials |
Abdulmajid Hashemzadeh, Klaus Kohlhammer, Thomas Lehmann |
2004-08-10 |
| 6727323 |
Process for reducing odor emission in aqueous polymer dispersions and in polymer powders |
— |
2004-04-27 |
| 6602951 |
Use of hydroperoxides as regulators in polymerizations |
Ulf Dietrich, Peter Ball |
2003-08-05 |
| 5814847 |
General purpose assembly programmable multi-chip package substrate |
Elias Shihadeh |
1998-09-29 |
| 5644167 |
Integrated circuit package assemblies including an electrostatic discharge interposer |
Jagdish G. Belani |
1997-07-01 |
| 5559056 |
Method and apparatus for capping metallization layer |
— |
1996-09-24 |
| 5527742 |
Process for coated bonding wires in high lead count packages |
Thomas Burke |
1996-06-18 |
| 5455745 |
Coated bonding wires in high lead count packages |
Thomas Burke |
1995-10-03 |
| 5424581 |
Crater prevention technique for semiconductor processing |
Haden J. Bourg, Jr, Jim McNelis |
1995-06-13 |
| 5316976 |
Crater prevention technique for semiconductor processing |
Haden J. Bourg, Jr., Jim McNelis |
1994-05-31 |
| 4355719 |
Mechanical shock and impact resistant ceramic semiconductor package and method of making the same |
Sally K. Hinds, Robert R. Hewitt |
1982-10-26 |