Issued Patents All Time
Showing 1–25 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8563345 | Integration of structurally-stable isolated capacitive micromachined ultrasonic transducer (CMUT) array cells and array elements | Steven J. Adler, Peter Johnson, Gokhan Percin | 2013-10-22 |
| 7838991 | Metallurgy for copper plated wafers | Viraj A. Patwardhan | 2010-11-23 |
| 7514769 | Micro surface mount die package and method | — | 2009-04-07 |
| 7468288 | Die-level opto-electronic device and method of making same | Joseph O. Smith | 2008-12-23 |
| 7423337 | Integrated circuit device package having a support coating for improved reliability during temperature cycling | Viraj A. Patwardhan, Hau Nguyen, Nikhil Kelkar | 2008-09-09 |
| 7405100 | Packaging of a semiconductor device with a non-opaque cover | Joseph O. Smith | 2008-07-29 |
| 7288439 | Leadless microelectronic package and a method to maximize the die size in the package | Gerald Alexander Fields | 2007-10-30 |
| RE39854 | Lead frame chip scale package | Joseph O. Smith | 2007-09-25 |
| 7253078 | Method and apparatus for forming an underfill adhesive layer | Luu Thanh Nguyen, Hau Nguyen, Viraj A. Patwardhan, Nikhil Kelkar | 2007-08-07 |
| 7171745 | Apparatus and method for force mounting semiconductor packages to printed circuit boards | Joseph O. Smith | 2007-02-06 |
| 7144800 | Multichip packages with exposed dice | Joseph O. Smith | 2006-12-05 |
| 7098518 | Die-level opto-electronic device and method of making same | Joseph O. Smith | 2006-08-29 |
| 7095096 | Microarray lead frame | — | 2006-08-22 |
| 7067927 | Die with integral pedestal having insulated walls | — | 2006-06-27 |
| 7012282 | Bumped integrated circuits for optical applications | Joseph O. Smith | 2006-03-14 |
| 7002241 | Packaging of semiconductor device with a non-opaque cover | Joseph O. Smith | 2006-02-21 |
| 6984866 | Flip chip optical semiconductor on a PCB | Joseph O. Smith, Matthew D. Penry | 2006-01-10 |
| 6975038 | Chip scale pin array | — | 2005-12-13 |
| 6936929 | Multichip packages with exposed dice | Joseph O. Smith | 2005-08-30 |
| 6894376 | Leadless microelectronic package and a method to maximize the die size in the package | Gerald Alexander Fields | 2005-05-17 |
| 6888228 | Lead frame chip scale package | Joseph O. Smith | 2005-05-03 |
| 6823582 | Apparatus and method for force mounting semiconductor packages to printed circuit boards | Joseph O. Smith | 2004-11-30 |
| 6812125 | Substrate for semiconductor packaging | — | 2004-11-02 |
| 6740961 | Lead frame design for chip scale package | — | 2004-05-25 |
| 6710246 | Apparatus and method of manufacturing a stackable package for a semiconductor device | Joseph O. Smith | 2004-03-23 |