Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11206967 | Compact binocular image capture device | John A. Barton, Mathew D. Clopp, John E. Sell | 2021-12-28 |
| 10575714 | Compact binocular image capture device | John A. Barton, Mathew D. Clopp, John E. Sell | 2020-03-03 |
| 8946875 | Packaged semiconductor devices including pre-molded lead-frame structures, and related methods and systems | Nikhil Vishwanath Kelkar, Lynn K. Wiese | 2015-02-03 |
| 8324602 | Optical sensors that reduce specular reflections | Lynn K. Wiese, Nikhil Vishwanath Kelkar | 2012-12-04 |
| 8232541 | Optical sensors that reduce specular reflections | Lynn K. Wiese, Nikhil Vishwanath Kelkar | 2012-07-31 |
| 7838991 | Metallurgy for copper plated wafers | Shahram Mostafazadeh | 2010-11-23 |
| 7674702 | Solder bump formation in electronics packaging | Nikhil Vishwanath Kelkar | 2010-03-09 |
| 7642175 | Semiconductor devices having a back surface protective coating | Lian Hee Tan, Nikhil Vishwanath Kelkar | 2010-01-05 |
| 7629246 | High strength solder joint formation method for wafer level packages and flip applications | Hau Nguyen | 2009-12-08 |
| 7423337 | Integrated circuit device package having a support coating for improved reliability during temperature cycling | Hau Nguyen, Nikhil Kelkar, Shahram Mostafazadeh | 2008-09-09 |
| 7413927 | Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages | Hau Nguyen, Nikhil Kelkar | 2008-08-19 |
| 7375431 | Solder bump formation in electronics packaging | Nikhil Vishwanath Kelkar | 2008-05-20 |
| 7301222 | Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages | Hau Nguyen, Nikhil Kelkar | 2007-11-27 |
| 7253078 | Method and apparatus for forming an underfill adhesive layer | Luu Thanh Nguyen, Hau Nguyen, Nikhil Kelkar, Shahram Mostafazadeh | 2007-08-07 |
| 7135385 | Semiconductor devices having a back surface protective coating | Lian Hee Tan, Nikhil Vishwanath Kelkar | 2006-11-14 |
| 7095116 | Aluminum-free under bump metallization structure | Nikhil Vishwanath Kelkar, King Tong Lim, A. Tharumalingam Sri Ganesh | 2006-08-22 |
| 7015064 | Marking wafers using pigmentation in a mounting tape | Nikhil Vishwanath Kelkar | 2006-03-21 |
| 6972244 | Marking semiconductor devices through a mount tape | Nikhil Vishwanath Kelkar, You Chye How, Tian Oon Goh, Soi Chong Low | 2005-12-06 |