Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6184575 | Ultra-thin composite package for integrated circuits | Shahram Mostafazadeh | 2001-02-06 |
| 5790378 | High density integrated circuit package including interposer | — | 1998-08-04 |
| 5739581 | High density integrated circuit package assembly with a heatsink between stacked dies | Shahram Mostafazadeh | 1998-04-14 |
| 5705851 | Thermal ball lead integrated package | Shahram Mostafazadeh, Jagdish G. Belani | 1998-01-06 |
| 5650659 | Semiconductor component package assembly including an integral RF/EMI shield | Shahram Mostafazadeh, Jagdish G. Belani | 1997-07-22 |
| 5648679 | Tape ball lead integrated circuit package | Shahram Mostafazadeh | 1997-07-15 |
| 5627405 | Integrated circuit assembly incorporating an anisotropic elecctrically conductive layer | — | 1997-05-06 |
| 5569955 | High density integrated circuit assembly combining leadframe leads with conductive traces | Shahram Mostafazadeh | 1996-10-29 |
| 5569956 | Interposer connecting leadframe and integrated circuit | Jaime A. Bayan | 1996-10-29 |
| 5498901 | Lead frame having layered conductive planes | Shahram Mostafazadeh | 1996-03-12 |
| 5442230 | High density integrated circuit assembly combining leadframe leads with conductive traces | Shahram Mostafazadeh | 1995-08-15 |