Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6476478 | Cavity semiconductor package with exposed leads and die pad | Angel Orabuena Alvarez | 2002-11-05 |
| 6444499 | Method for fabricating a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components | Thomas P. Glenn | 2002-09-03 |
| 6441504 | Precision aligned and marked structure | Thomas P. Glenn, Steven Webster | 2002-08-27 |
| 6309943 | Precision marking and singulation method | Thomas P. Glenn, Steven Webster | 2001-10-30 |