Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8154111 | Near chip size semiconductor package | Sean T. Crowley, Jun Yang | 2012-04-10 |
| 8136910 | Calibration method for a printer | Pasqual Batalla, Jordi Sender, Marc Bautista, Toni Gracia, Jean-Frederic Plante +6 more | 2012-03-20 |
| 7045396 | Stackable semiconductor package and method for manufacturing same | Sean T. Crowley, Jun Yang | 2006-05-16 |
| 6753597 | Encapsulated semiconductor package including chip paddle and leads | Sean T. Crowley | 2004-06-22 |
| 6639308 | Near chip size semiconductor package | Sean T. Crowley, Jun Yang | 2003-10-28 |
| 6605866 | Stackable semiconductor package and method for manufacturing same | Sean T. Crowley, Jun Yang | 2003-08-12 |
| 6476478 | Cavity semiconductor package with exposed leads and die pad | Gary L. Swiss | 2002-11-05 |